BS EN 62258-6-2006 半导体压模制品.关于热模拟的信息要求
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【英文标准名称】:Semiconductordieproducts-Requirementsforinformationconcerningthermalsimulation
【原文标准名称】:半导体压模制品.关于热模拟的信息要求
【标准号】:BSEN62258-6-2006
【标准状态】:现行
【国别】:英国
【发布日期】:2006-11-30
【实施或试行日期】:2006-11-30
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:组件;特性;芯片;部件;交付;电气工程;电子工程;电子设备及元件;集成电路;材料;生产;半导体器件;半导体;规范(验收);测试;热的;晶片
【英文主题词】:Assemblies;Behaviour;Chips;Components;Delivery;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Integratedcircuits;Materials;Production;Semiconductordevices;Semiconductors;Specification(approval);Testing;Thermal;Wafers
【摘要】:ThispartofIEC62258hasbeendevelopedtofacilitatetheproduction,supplyanduseofsemiconductordieproducts,including:?wafers;?singulatedbaredie;?dieandwaferswithattachedconnectionstructures;?minimallyorpartiallyencapsulateddieandwafers.ThispartofIEC62258determinestheinformationrequiredtofacilitatetheuseofthermaldataandmodelsforsimulationofthethermalbehaviourandverificationofthecorrectfunctionalityofelectronicsystemsthatincludebaresemiconductordie,withorwithoutconnectionstructures,and/orminimallypackagedsemiconductordie.ItisintendedtoassistallthoseinvolvedinthesupplychainfordiedevicestocomplywiththerequirementsofIEC62258-1andIEC62258-2.
【中国标准分类号】:L40
【国际标准分类号】:31_200
【页数】:14P;A4
【正文语种】:英语
【原文标准名称】:半导体压模制品.关于热模拟的信息要求
【标准号】:BSEN62258-6-2006
【标准状态】:现行
【国别】:英国
【发布日期】:2006-11-30
【实施或试行日期】:2006-11-30
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:组件;特性;芯片;部件;交付;电气工程;电子工程;电子设备及元件;集成电路;材料;生产;半导体器件;半导体;规范(验收);测试;热的;晶片
【英文主题词】:Assemblies;Behaviour;Chips;Components;Delivery;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Integratedcircuits;Materials;Production;Semiconductordevices;Semiconductors;Specification(approval);Testing;Thermal;Wafers
【摘要】:ThispartofIEC62258hasbeendevelopedtofacilitatetheproduction,supplyanduseofsemiconductordieproducts,including:?wafers;?singulatedbaredie;?dieandwaferswithattachedconnectionstructures;?minimallyorpartiallyencapsulateddieandwafers.ThispartofIEC62258determinestheinformationrequiredtofacilitatetheuseofthermaldataandmodelsforsimulationofthethermalbehaviourandverificationofthecorrectfunctionalityofelectronicsystemsthatincludebaresemiconductordie,withorwithoutconnectionstructures,and/orminimallypackagedsemiconductordie.ItisintendedtoassistallthoseinvolvedinthesupplychainfordiedevicestocomplywiththerequirementsofIEC62258-1andIEC62258-2.
【中国标准分类号】:L40
【国际标准分类号】:31_200
【页数】:14P;A4
【正文语种】:英语
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